Multilayer circuit boards and processes of making the same
US5928790A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 1996 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Apr 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.