Addition curable composition having self adhesion to substrates
US5928794A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to the preparation of an addition curable composition having self adhesion to substrates. The addition curable composition comprises an organic polymer having on average at least 1.4 alkenyl groups per molecule, a crosslinker having on average at least 1.4 hydrosilyl groups per molecule, a platinum group metal containing catalyst, an alkoxy silicon compound and a titanium compound having Ti--O--C bonds. Another embodiment of this invention is a method of adhering the addition curable composition to a substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.