Fluoroaliphatic cyanate resins for low dielectric applications
US5929199A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1998 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Jan 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31525
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is a cyanate resin monomer having the formula: EQU NCO--CH.sub.2 --(CF.sub.2).sub.n --CH.sub.2 --OCN where n is an even integer from 6 to 10, inclusive. Another aspect of the invention is an essentially pure cyanate resin mono having the formula: EQU NCO--CH.sub.2 --(CF.sub.2).sub.n --CH.sub.2 --OCN where n=3, 4, 6, 8, or 10. Another aspect of the invention is a prepolymer made by the process of heating a monomer of the invention to a conversion below the gel point. Another aspect of the invention is a method for depositing an interlevel dielectric resin on an integrated circuit, having the steps: (a) coating the integrated circuit with a thin film of a prepolymer made by the process of heating a monomer of the invention to below the gel point, and (b) curing the prepolymer to at least the gel point. Another aspect of the invention is a low dielectric thermoset polymer resin made from these monomers. Another aspect of the invention is a composite of a resin of the invention combined with another material or materials, for structural and/or electronic applications. Such materials include powders and fibers made from, e.g., fused silica or quartz. Another aspect…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.