Integrated electronic circuit
US5929510A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 30, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Oct 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.