Polymer stud grid array
US5929516A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Mar 21, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Mar 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.