Heat sink mounting assembly for surface mount electronic device packages
US5930114A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.