Method for mixed placement of structured and non-structured circuit elements
US5930499A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1996 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | May 20, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention resides in a computer-aided design system for defining physical placement and floor-planning of electronic circuits on a given substrate. Improve utilization of substrate area is achieved by arranging circuits into structural (e.g., data-path) and non-structural (e.g., non-data-path) zones for effectively segregated chip or board lay-out. Software is provided to receive a netlist file and determine therefrom which components are categorizable within structural portion. Furthermore, software is provided to produce a lay-out file which defines physical placement of the prototype design, wherein structural components are inter-placed with related control components, for example, to provide sliced-structure placement of a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.