Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same
US5930598A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1998 |
| Grant date | Jul 27, 1999 |
| Priority date | — |
| Expiry date | Jul 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.