Semiconductor accommodating devices and method for inserting and taking out semiconductor devices
US5931337A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Oct 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor accommodating device using an embossed tape and a method for inserting and taking out semiconductor devices, without using a top cover tape that had hitherto been used. The semiconductor accommodating device comprises a reel and an embossed tape wound on the reel. The embossed tape has a bottom wall for placing a semiconductor device thereon, two side walls upwardly extending from both side edges of the boom wall, and top walls having an opening. The side walls are formed such that the semiconductor device inserted through the opening is held by the side walls with the semiconductor device placed on the bottom wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.