Wire clamper for bonding apparatus
US5931452A · kind A · utility
7Cited by
8References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 10, 1998 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Feb 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire clamper for a bonding apparatus includes a pair of clamper arms having tip portions, respectively. The tip portions clamp or release a wire therebetween when at least one of the clamper arms is operated. The wire clamper further includes a giant-magnetostrictive actuator having a giant-magnetostrictive alloy and a coil wound around the giant-magnetostrictive alloy for generating a magnetic field. The giant-magnetostrictive alloy is displaced according to the magnetic field generated by the coil so as to operate at least one of the clamper arms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.