Chemical mechanical polishing apparatus
US5931722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Feb 13, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus is provided which is capable of polishing an essentially non-streaked mirrored surface in a highly efficient manner, and which is capable of achieving a degree of flatness of +/-0.1 mm or less. The apparatus is provided with a polishing plate holder 43 which adheres to a material to be polished 40 and rotates; a plurality of polishing pads 42 which have a diameter smaller than that of the material to be polished 40 and which are disposed in a symmetrical manner about an axle, a mechanism for causing the plurality of polishing pads 42 to rotate individually, a mechanism for causing the plurality of polishing pads 42 to revolve about the axle and a mechanism for causing the polishing pads 42 to move in a transverse and longitudinal manner with respect to the material to be polished 40; the front surfaces of the polishing pads 42 are caused to rub against the surface of the material to be polished, and a polishing slurry is supplied to the center of the front surfaces of the polishing pads 42. The polishing slurry is supplied in a pressurized manner, and uniformity and flatness are thus improved. The polishing slurry is degassed, and by means …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.