Patent · US Expired

Process for the currentless metallization of electrically non-conductive substrates

US5932300A · kind A · utility

0Cited by

0References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Lothar Weber · Stuttgart, DE
Kurt Schmid · Ditzingen, DE
Ralf Haug · Leonberg, DE
Dorothee Kling · Leonberg, DE

Key dates

Filing date	Sep 8, 1997
Grant date	Aug 3, 1999
Priority date	—
Expiry date	Sep 8, 2017

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/185
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.