Photo-curable resin composition and process for preparing resin-basedmold
US5932625A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 30, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | May 30, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F222/103
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.