Adhesion promoter for a polyamid-compounds
US5932686A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Oct 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31736
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to adhesion agents and compatibility agents, respectively, on the basis of partially crystalline, high-molecular block (co)polyester amides, produced by direct esterification of carboxyl-terminated or hydroxycarboxyl-terminated polyamide precondensates and hydroxyl-terminated or hydroxycarboxyl-terminated polyester segments, characterized in that the block (co)polyester amides form two crystalline phases and comprise as segments PA1 (A) at least one polyamide or copolyamide block having a uniform number average molar mass of at least 1000 g/mole, PA1 (B) at least one aromatic polyester and/or copolyester block having a uniform number average molar mass of at least 1000 g/mole, and PA1 (C) at least one further diol component of the general structure EQU HO--R--OH, wherein R is selected from the group consisting of aliphatic or partially aromatic (co)polyesters, aliphatic polyethers, aliphatic (co)polyester amides, polycarbonates or aliphatic or aromatic hydrocarbons. Furthermore, this invention concerns a process for the production of the above-mentioned block (co)polyester amide molding compounds as well as various possible uses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.