Pressure sensor module having dual insulating substrates on the pressure sensing and non-pressure sensing sides
US5932808A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0075
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a pressure sensor module which is capable of restraining application of a pressure of increased magnitude to a connector, reducing the number of parts therefor and compacting a structure thereof. A connector body (3a) is provided on a base section thereof with a flange (3g). An annular support (4) which is made of a material hard to be deformed under a high pressure as compared with the connector body (3a) is provided with an annular engagement recess (4b). The annular support (4) is fitted on the connector body (3a) to engage the flange (3g) with the annular engagement recess (4b). The annular support (4) is contacted on one end surface (4a) thereof with a pressure non-sensing side insulating substrate (5a) of a pressure sensing element (5) outside the base section of the connector body (3a). A housing (7) includes a cylindrical engagement section (7g1), which is curled so as to surround an outer edge of an end surface (4c) of the annular support (4), to thereby accomplish engagement between the housing (7) and the annular support (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.