Method for dissipating heat away from a heat sensitive device using bicarbonate compositions
US5932839A · kind A · utility
13Cited by
19References
14Claims
0Family size
Inventors
Key dates
| Filing date | Nov 4, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Nov 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/021
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides methods and compositions useful for heat absorption and dissipation, which include between about 10 percent and about 99 percent by weight of a bicarbonate compound and between about 90 percent and about 1 percent by weight of binder, and thermally protected enclosures including the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.