Electronic component lid that provides improved thermal dissipation
US5933323A · kind A · utility
29Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | Aug 3, 1999 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lid that provides thermal dissipation for an integrated circuit. The lid is designed to be fastened to a printed circuit board and includes a casing having thermally conductive upper and lower plates. Between the upper and lower plates, inside the casing, is a hollow interior region within which vaporizing fluid and two or more segments of wick reside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.