Method for manufacturing plastic package for electronic device having a fully insulated dissipator
US5935502A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a package of plastic material for a semiconductor electronic device having heat sink fully embedded within the package plastic case, is of the type which provides for forming the plastic case within a mold on whose interior a heat sink has been placed which has a first major surface to be insulated by means of a plastic material layer with a first thickness, whereon a metal leadframe and at least one semiconductor material die having an electronic circuit formed thereon have been fixed, and a second major surface opposite from the first and to be insulated by means of a plastic material layer with a second thickness, thinner than said first thickness; and at least one supporting element adapted to be positioned inside the mold cavity facilitating properly spacing the second surface of the heat sink out from a facing wall of the mold cavity during the process of introducing the plastic material for molding. The heat sink is supported only from the side of the second surface by said at least one supporting element being attached to said wall of the cavity and held within the mold cavity during the injection of plastic material and until the latter becomes fully s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.