Device for shaping a microstructure substrate

US5935622A · kind A · utility

Assignee

• Harting Elektro-optische Bauteile GmbH & Co. KG · DE

Inventors

• Wolfgang Pott · Darmstadt, DE
• Hans Kragl · Ober-Ramstadt, DE

Key dates

• Filing date: Feb 26, 1997
• Grant date: Aug 10, 1999
• Expiry date: Feb 26, 2017

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29L2011/00
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

For the shaping of a microstructure substrate via a mold cavity, an unmolding device allows an abrupt, shear-free separation, in particular at reaction temperature, of the microstructure substrate manufactured using the reaction molding method. Optical waveguide components meeting stringent damping requirements can easily be manufactured with this device.