Test head for IC tester
US5936417A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1997 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Aug 19, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
To provide a test head for an IC tester wherein identical test signals can be distributed to a plurality of devices to be tested while holding in check an increase in the number of signal lines connecting a waveform shaper to the test head, upsizing of the test head, and an increase in power consumption. A plurality of pin-electronics-cards are connected with each other via a printed wiring pattern on a back board provided inside a test head, a waveform signal shaped at a waveform shaper is received by a receiver card provided in the test head and the waveform signal delivered from the receiver card is distributed to the plurality of the pin-electronics-cards via the printed wiring pattern provided on the back board while the end of the printed wiring pattern is terminated at the termination card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.