Printed wiring board with mounted circuit element using a terminal density conversion board
US5936843A · kind A · utility
151Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1998 |
| Grant date | Aug 10, 1999 |
| Priority date | — |
| Expiry date | Mar 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.