Method of manufacturing bonded dual extruded, high fin density heat sinks
US5937517A · kind A · utility
27Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49936
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a high performance, high fin density heat sink (10) uses extruded first and second base elements having an alternating arrangement of closely spaced fins and recesses for receiving opposing fins. The fins in the first and second base elements are bonded to the recesses formed in the common face of the opposing base element to form the bonded extruded heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.