Heat sink and method for removing heat from a plurality of components
US5937937A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1998 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jun 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The heat sink has an interior and has a first exterior surface and a second exterior surface, and includes a first heat removal region disposed in the interior. The first heat removal region defines a first cavity and is at least partially filled with a liquid. The first heat removal region transfers a first amount of heat from a first electronic device via a pool boiling phenomenon when the first electronic device is disposed on the first exterior surface. A first conduction-inhibiting region is disposed proximate the first cavity. A second heat removal region is disposed in the interior. The second heat removal region defines a second cavity and is at least partially filled with the liquid. The second heat removal region transfers a second amount of heat from a second electronic device via the pool boiling phenomenon when the second electronic device is disposed on the first exterior surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.