High speed jet soldering system
US5938102A · kind A · utility
39Cited by
22References
22Claims
0Family size
Inventors
Key dates
| Filing date | Jan 5, 1996 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jan 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/013
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.