Method for metallizing a phosphor layer
US5938872A · kind A · utility
1Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jan 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J29/28
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Two embodiments of a method for metallizing a phosphor layer are presented. The key to the method is covering the phosphor with a temporary planarizing layer onto which the metallizing layer (typically aluminum) is then deposited. Once the metal layer is in place, the planarizing layer is removed (by a burning process), the metal then making good contact with the phosphor and the substrate. In the first embodiment, the dry film is located below the phosphor layer while in the second embodiment it is located above it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.