Stabilized porous, electrically conductive substrates
US5939206A · kind A · utility
57Cited by
23References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1996 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Aug 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an apparatus which comprises at least one semiconductor chip mounted on a substrate, said substrate comprising a porous, electrically conductive member having electrophoretically deposited thereon a coating of a polymeric material. In one embodiment, the semiconductor chips are thermal ink jet printhead subunits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.