Low application temperature hot melt with excellent heat and cold resistance
US5939483A · kind A · utility
51Cited by
17References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jul 14, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J153/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt useful for packaging comprising a) from about 10% to about 40% by weight of a block copolymer; b) up to about 20% of a compatible polymer wherein the total polymer content does not exceed 40% by weight; c) from about 25% to about 60% by weight of at least one tackifying resin; d) from about 5% to about 25% by weight of a compatible plasticizer; and e) from about 10% to about 40% by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.