Bi-directional cooling arrangement for use with an electronic component enclosure
US5940266A · kind A · utility
50Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Oct 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A processor book includes a processor card having front and rear surfaces, and at least one high heat component attached to the front surface. Two separate flows of cooling gas are conveyed to the processor card from two separate directions. A cooling duct is provided adjacent to the front surface of the processor card, and conveys one of the flows of cooling gas. The cooling duct has an outlet in a region of the high heat component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.