Card cage mounted power supply with heat dissipating architecture
US5940288A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1998 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Jun 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin power supply is configured to be mounted vertically within a card cage for pin assembly connection with the forward face of a backplane. Through the utilization of a vertical flat metal platform in combination with a thin sheet metal folded fin array, the components of the power supply may be cooled by fan driven air of passing through the card cage itself. To achieve heat dissipation, those components of the power supply which exhibit higher heat dissipation characteristics are firmly coupled with the power supply platform such that the bulk of the heat generated by them is dissipated by the folded fin array and the card cage fan driven air passing over and through it. Other components not having high beat dissipation characteristics are circuit board mounted and cooled by the movement of fan driven card cage air flow which passes through the housing of the power supply.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.