Floor-laying
US5941047A · kind A · utility
Inventor
Key dates
| Filing date | Sep 10, 1997 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Sep 10, 2017 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/023
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method of laying floors or like surfaces with desired material, wherein the floors or like surfaces are supported by or comprised of rigid units in the form of boards or like elements. The boards are provided with tongues and grooves on respective edges thereof to enable boards to be joined to mutually adjacent boards. The method is mainly characterized by using boards that have been provided with a friction layer on their undersides. A corresponding friction layer is placed on the underlying sub-floor. A sheet of material is removably placed on the underside of the boards and transfers and places one board adjacent to another board. The boards are laid loosely on the friction layer of the sub-floor and mutually joined to adjacent boards solely by coacting between the tongues and grooves of respective boards in the absence of any binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.