Apparatus for calibrating surface mounting processes in printed circuit board assembly manufacturing
US5942078A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 17, 1997 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Jul 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/305
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the invention provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.