Method and apparatus for classifying a defect on a semiconductor wafer
US5943437A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 7, 1996 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Oct 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface image of a semiconductor wafer having a defect is picked up as a inspection image while a surface image of a semiconductor wafer having no defect is stored in an image memory as a reference image. A density difference image between the inspection image and the reference image. By extracting the defect in wiring and non-wiring regions from the density difference image, extract images are obtained. Two luminance information for wiring and non-wiring regions are obtained from extract images. Based on the luminance information, the type of the defect is determined and a production process where the defect has occurred is detect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.