Applying semiconductor laser mirror layers after securing support plate to laser body
US5943553A · kind A · utility
11Cited by
19References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/028
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing a semiconductor component having a semiconductor body secured to a support plate comprises securing the support plate on a surface of the semiconductor body before applying the cover layers which form mirrors on the end surfaces of the semiconductor body. The support plate is preferably made of an electrically and thermally conducting material which has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the semiconductor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.