Method for manufacturing fine structures
US5943571A · kind A · utility
15Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1997 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Jun 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/035
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
For manufacturing fine structures, nuclei that define the dimensions of the fine structures are formed on the surface of a substrate in a CVD process upon employment of a first process gas that contains SiH.sub.4 and GeH.sub.4 in a carrier gas. The nuclei can be employed both as a mask, for example, when etching or implanting, as will as active or passive component parts that remain in the structure, for example, as charge storages in the dielectric of an EEPROM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.