Patent · US Expired

Method for producing integrated circuits and coils on carrier webs

US5943769A · kind A · utility

2Cited by

14References

4Claims

0Family size

Assignee

GIESECKE & DEVRIENT GMBH · DE

Inventors

Arno Hohmann · Munich, DE
Joachim Hoppe · Munich, DE
Yahya Haghiri-Tehrani · Munich, DE

Key dates

Filing date	Jan 15, 1998
Grant date	Aug 31, 1999
Priority date	—
Expiry date	Jan 15, 2018

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.