Apparatus and method for depositing a material on a substrate
US5945163A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1998 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Feb 19, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/151
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus (12, 12a) and a method for depositing a material on a substrate (G) utilizes a distributor (22) including a heated permeable member (24) through which a carrier gas and a material are passed to provide a vapor that is deposited on a conveyed substrate. The permeable member (24) is tubular and has an electrical voltage applied along its length to provide the heating, and the carrier gas and the material as a powder are introduced into the tubular permeable member for flow outwardly therefrom as the vapor. A shroud (34) extending around the tubular permeable member (24) has an opening (36) through which the vapor flows for the deposition. In one embodiment of apparatus (12), the vapor is deposited on an upwardly facing surface (56) of the substrate, while another embodiment of the apparatus (12a) deposits the vapor on a downwardly facing surface (54) of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.