Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board
US5945222A · kind A · utility
10Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Jan 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thermosetting resin composition (a) comprising 60 to 97% by weight of a thermosetting resin containing dihydrobenzoxazine rings and 3 to 40% by weight of a novolac phenolic resin and a thermosetting resin composition (b) comprising 5 to 30% by weight of the thermosetting resin and 70 to 95% by weight of a novolac phenolic resin are cured fast, and the cured products thereof are excellent in mechanical properties and non-flammability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.