Method of forming resistors
US5945257A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/073
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for forming resistors that are low cost, easy to manufacture and substantially within 5 percent of their desired value. In one aspect of the method, an electrically resistive material, such as nickel, is deposited directly on an insulating layer, such as a substrate. A conductive material, such as copper, is then deposited on the resistive material. Using photo-imaging, signal traces are formed in the conductive and resistive materials. A resistor is created by forming a gap in the conductive material at a location where the resistor is desired. Current is thereby forced to flow through the resistive material at the location of the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.