Power transistor module packaging structure
US5946192A · kind A · utility
38Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Jul 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus which secures a heat sink to an electrical component connected to a circuit board, including a first outer cover which engages a portion of the heat sink and a portion of the circuit board. In addition, the first outer cover encloses the electrical component, and the electrical component has at least two pins, a first surface facing the circuit board, and a second surface facing the heat sink. Further, a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.