Circuit board enclosure having heat transfer circuit board support
US5946193A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Sep 12, 2017 |
Classification
- Technology area (CPC —)General
Abstract
A circuit board enclosure for housing a plurality of circuit boards has a polymer casing having upper and lower openings and an interior. The circuit board enclosure also has upper and lower heat conductive pieces formed of a metal and fitting respectively within the upper and lower openings in the casing, in a water tight sealed relationship with the casing. The upper and lower heat conductive pieces have heat transfer fins protruding from the openings in the casing. The upper and lower heat conductive pieces have an interior side facing the interior of the enclosure. The interior sides have guide grooves to receive opposing sides of the circuit board. The guide grooves of the upper and lower heat conductive pieces are substantially parallel. The polymer casing may be formed of polycarbonate. The upper and lower heat conductive pieces may be formed of aluminum. The casing may have two upper and two lower holes, with each heat conductive piece having two sets of heat transfer fins fitting respectively through the two holes in the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.