Method for cutting wafers from a crystal

US5947102A · kind A · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Vernon E. Knepprath · Sherman, US
• Walter Frank · Altötting, DE
• Maximilian Kaeser · Burghausen, DE
• Albert Pemwieser · Ach, AT

Key dates

• Filing date: Aug 12, 1997
• Grant date: Sep 7, 1999
• Expiry date: Aug 12, 2017

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K3/1472
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A sawing suspension composition is composed of an essentially nonaqueous or anhydrous organic liquid in which hard-material particles are dispersed. The liquid is selected from a group of compounds which comprises low molecular weight polyglycols and any desired mixture of these polyglycols. The sawing suspension is used in conjunction with a wire saw for cutting wafers from a crystal of a brittle and hard material.