Method and a device for permitting cooling of heat-sensitive components
US5947188A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 1998 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Mar 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20872
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device (10) for cooling heat-sensitive components is disclosed. The device includes a housing (12) for receiving the components, and attachment means integral with the housing for attaching the device (10) to another component (24). The attachment means is provided with at least one passage (30; 32) for through flow of a cooling medium. The attachment means has an attachment member (22) connected to the housing (12) via a heat-conducting flange (23), with the attachment member having means for providing the attachment member between two components (26, 28), which components, in the absence of the attachment member, are couplable to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.