Laser shock peening quality assurance by volumetric analysis of laser shock peened dimple
US5948293A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1998 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Dec 3, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2240/303
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for quality assurance of a laser shock peening process that quantitatively analyzes a single laser shock peened dimple or spot. The method measures a first interior surface of the first dimple to obtain height data and the processes the height data to obtain production volumetric data of the dimple. The volumetric data may then be compared to a predetermined correlation of test volumetric data and high cycle fatigue failure based on high cycle fatigue tests of test pieces that were laser shock peened in the same or similar laser shock peening apparatus as the production workpieces. The test pieces may each have a failure precipitating flaw within a laser shock peened area of the test piece that was laser shock peened in the same or similar laser shock peening apparatus. Preferably, the measuring is performed using a profilometer such as an interferometric optical profilometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.