Method for forming fiducial mark in resin stencil and stencil formed thereby
US5948466A · kind A · utility
7Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1997 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Dec 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An engraved recess (4) is formed in a resin stencil (1) at a position on a surface of the resin stencil where the resin stencil, when registered with a circuit board, agrees with a fiducial mark of the circuit board. The recess is formed by a laser (3) and serves as a fiducial mark.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.