Vertically interconnected electronic assemblies and compositions useful therefor
US5948533A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1997 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Mar 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.