Heat spreader
US5949138A · kind A · utility
5Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1997 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Oct 31, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At least one set of opposing members (20) extends inwardly, but do not contact, within the aperture (14). The opposing members (20) can receive adhesive material for securing the semiconductor die (32) to the heat spreader (10) such that the semiconductor die (32) is disposed over the aperture (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.