Semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power
US5949139A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1998 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Apr 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This is provided a dual-surface mounting type semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power. In the dual-surface mounting type semiconductor integrated circuit device, a specified circuit for implementing a function common to integrated circuit chips and mounted on both surfaces of a chip mounting section of a lead frame is provided only for the integrated circuit chip of one surface, and an output signal of the specified circuit provided only for the integrated circuit chip of this one surface is transmitted to the integrated circuit chip of the other surface via bonding wires and an internal lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.