Method of fabricating a thermoelectric module
US5950067A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1998 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Mar 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
Abstract
A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.