Heat exchanger for cooling semi-conductor components
US5950721A · kind A · utility
7Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section, The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.