Fanout interconnection pad arrays
US5951304A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | May 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For providing multiple-conductor circuit interconnections where there is a lack of precise dimensional control, as in manufacturing flexible printed circuits used to make high density electrical interconnections between ultrasonic transducer elements and the probe cable in a medical ultrasound probe, connection pads are formed in fanout arrays, with the longitudinal axes of individual pads extending along radial lines from the center of a circle. The fanout arrays are formed within generally trapezoidal areas, each having two parallel opposite sides extending along respective parallel chords to accommodate significant variation in dimensions of the respective substrates being connected. Multiple-row connection pad arrays may be provided, each with a plurality of fanout arrays of connection pads that may be parallel to each other and positioned at respectively different distances from the center of the circle, or may be arranged around, and positioned at equal distances from, the center of the circle. If the circuit substrate is anisotropic, the connection pads are on curved pad-locating lines defined by y=Ax.sup..beta., where (x,y)=(0,0) defines the circle center, A is a proportion…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.